Predicting Microstructure-Creep Resistance Correlation in High Temperature Alloys Over Multiple Time Scales Email Page
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Performer: Purdue University
Scan of a sample analyzed for nano- and microscale indentation creep properties.
Scan of a sample analyzed for nano- and microscale indentation creep properties.
Website: Purdue University
Award Number: FE0011291
Project Duration: 07/22/2013 – 07/21/2016
Total Award Value: $300,000
DOE Share: $300,000
Performer Share: $0
Technology Area: University Training and Research
Key Technology: High Performance Materials
Location: West Lafayette, Indiana

Project Description

New developments in high-temperature, corrosion-resistant refractory alloys have shown promise of extended survival in environments that can exceed 1500ºC. The effect of grain boundaries (GBs), including quasi-liquid intergranular films (IGFs) formed at high temperatures, is an important limitation of an alloy’s applicability in such harsh environments. This project will focus on predicting the creep and associated microstructure evolution of W-based refractory alloys. The researchers will use a new concept, GB diagrams, to establish time-dependent creep resistance and associated microstructure evolution of GBs/IGFs controlled creep as a function of load, environment and temperature.

Project Benefits

This project will predict microstructure-creep resistance correlation in high temperature alloys over multiple time scales. Overall, improvement to high-temperature advanced-materials will promote the development of advanced power plant designs that can operate at higher temperatures and pressures, leading to improvements in efficiency and operational flexibility, resulting in lower capital and operating costs.

Contact Information

Federal Project Manager Jason Hissam:
Technology Manager Robert Romanosky:
Principal Investigator Vikas Tomar:


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