Advanced Ceramic Materials and Packaging Technologies for Realizing Sensors Operable in Advanced Energy Generation Systems Email Page
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Performer: Sporian Microsystems Inc.
High-Temperature Harsh Environment Packaging
High-Temperature Harsh Environment Packaging
Website: Sporian Microsystems Inc.
Award Number: SC0008269
Project Duration: 06/28/2012 – 08/13/2018
Total Award Value: $2,159,100
DOE Share: $2,159,100
Performer Share: $0
Technology Area: Plant Optimization Technologies
Key Technology:
Location: Lafayette, CO

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