Advanced Ceramic Materials and Packaging Technologies for Realizing Sensors Operable in Advanced Energy Generation Systems Email Page
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Performer: Sporian Microsystems Inc.
High-Temperature Harsh Environment Packaging
High-Temperature Harsh Environment Packaging
Website: Sporian Microsystems Inc.
Award Number: SC0008269
Project Duration: 06/28/2012 – 08/13/2018
Total Award Value: $2,159,100
DOE Share: $2,159,100
Performer Share: $0
Technology Area: Plant Optimization Technologies
Key Technology:
Location: Lafayette, CO

Project Description

The objective of this project is to develop ultra-high temperature "smart" sensors from silicon carbon nitride (SiCN) materials for energy generation and aerospace systems. The sensors will be developed from innovative fabrication processes and contain internal compensation, health check and data bus support to the interface. The project will build a sensor utilizing a class of high-temperature ceramic materials synthesized by thermal decomposition of polymeric precursors, which possess excellent mechanical properties up to 1800ÂșC. The project will also construct and fabricate designs for multiple sensors to produce bench- and -pilot scale operable demonstration ready sensing.

Project Benefits

Expected benefits include sensor development from innovative fabrication processes with internal compensation, health check and data bus support to the interface. By continuous condition monitoring of high temperature surrounding using these sensors, one can expect lower failure rates, improved contact and reduced moisture collection with sensing at the source, and overall lower cost associated with life and system failures.

Contact Information

Federal Project Manager Sydni Credle: sydni.credle@netl.doe.gov
Technology Manager Briggs White: briggs.white@netl.doe.gov
Principal Investigator Yiping Liu: yliu@sporian.com

 

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